Upcoming Huawei P8 reveals its specs during a TENAA visit


The yet to be announced Huawei P8 revealed its specifications in a TENAA certification filing. The Chinese giant’s next flagship smartphone is expected to make its official debut in a little over two weeks, on April 15.



As expected, the TENAA filing reveals the specifications of the upcoming device. They include a 64-bit Kirin 930 chipset with octa-core CPU, 3GB of RAM, and 32GB of built-in memory, which can be further expanded via microSD card slot.



A 5.2” 1080p display and 13MP main camera will also be part of the setup. The device will boot Android Lollipop.


Huawei P8’s TENAA images reveal an slim body with metal frame and ultra-thin bezels. The smartphone is expected to carry a sub-$500 price tag when it hits the shelves.


Via



thumbnail
Judul: Upcoming Huawei P8 reveals its specs during a TENAA visit
Rating: 100% based on 99998 ratings. 5 user reviews.
Ditulis Oleh

Artikel Terkait Mobile :

0 komentar:

Poskan Komentar

 
Copyright © 2013. About - Sitemap - Contact - Privacy
Template Seo Elite oleh Bamz | Powered By Blogger